Tin Cynel Sn99.3Cu0.7 with flux SW26 1.00mm 14g Vial
ID: 578959
5906623405442
zł7.80
Tax included
zł6.34 tax excl.
Sn99.3Cu0.7 SW26 solder, produced by Cynel-Unipress, is a lead-free, rosin-based alternative to traditional fillers, meeting ISO 9453:2014 standards and the RoHS directive, ideal for professional and amateur soldering applications
Description
Sn99.3Cu0.7 SW26 solder is the most effective alternative to lead-based solders, offering exceptional performance for both professional and amateur applications. It is a lead-free product with medium activity, containing rosin halide flux.
Produced by Cynel-Unipress in the first smelting of tin and copper, it meets the quality standards specified by the ISO 9453:2014 standard. It is used in lead-free technology, adapting to the requirements of the RoHS directive, which allows its use in a wide range of applications, including the consumer sector.
The composition of the binder is dominated by tin, with copper content in the range of 0.5 - 0.9%. The minimal presence of other elements guarantees that the product is free from impurities. It is characterized by a melting point of 227°C, specific gravity of 7.31 g/cm3, resistivity of 0.126 μΩ•m and thermal conductivity of 66 W/m•K. The tensile strength is 300 kg/cm2 and the elongation at break is 21%. The recommended temperature of the soldering tip is 320 - 360°C, with the possibility of increasing it to 400°C for nickel-plated elements.
Alloy composition [%]
| Sn | Cu | Bi | Sb | Ag | Cd | Au | In | Pb | Al | As | Fe | Ni | Zn | inne |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| rest | 0,5 - 0,9 | 0,1 | 0,1 | 0,1 | 0,002 | 0,05 | 0,1 | 0,07 | 0,001 | 0,03 | 0,02 | 0,01 | 0,001 | - |
SW26 flux, an integral element of this binder, is a halide product based on modified rosin. It is optimal for many industrial and amateur applications, working effectively on most metal surfaces except aluminum and stainless steel. Its markings according to standards are SW26 according to DIN 8511, 1.1.2 according to ISO 9454-1, and ROL1 according to J-STD-004. It contains a standard content of 2.2% ± 0.2% of flux, with the possibility of agreeing other contents, halides at the level of 0.5% and an acid number of 180mg KOH/g. It is non-corrosive and complies with the copper mirror test, confirming its reliability and safety in use. Flux residues do not need to be removed, which makes the soldering process easier and faster.
Features
- Melting point: 227°C (eutectic alloy)
- Specific gravity: 7.31 g/cm3
- Resistivity: 0.126 μΩ*m
- Thermal conductivity: 66 W/m*K
- Tensile strength at break: 300 kg/cm2
- Elongation at break: 21%
- Hardness: 9 HB
- Recommended tip temperature for soldering: 320 - 360°C (for nickel-plated elements up to 400°C)
- Flux designation according to DIN 8511: SW26
- Flux designation according to ISO 9454-1: 1.1.2
- Flux designation according to J-STD-004: ROL1
- Standard flux content: 2.2% ± 0.2%
- Halide content in flux: 0.5%
- Acid number of flux: 180mg KOH/g
- Copper Mirror Test: Pass (per J-STD-004 IPC-TM-650 2.3.32D)
- Corrosivity: non-corrosive
578959
Data sheet
- Alloy
- Sn99,3Cu0,7
- Diameter
- 1 mm
- Weight
- 14g
- Flux
- SW26
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